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Technology of choice

for PCB and package substrate makers

VitroCoat GI

The adhesion promoter for plating on glass

Unparalleled

metallization coverage in high aspect TGV

Finer l/s Cu trace formation on glass

Superior adhesion

after industry standard reliability testing

Cu patterning on glass wafer with VitroCoat GI

  • Enables finer l/s Cu trace formation directly on glass
  • Excellent adhesion of plated Cu-film to glass with uniform surface distribution
  • Superior through-hole side-wall coverage with excellent adhesion
  • Applicable for panel as well as wafer scale
  • Sustains good adhesion after reliability testing
  • No electro-migration (B-HAST)
  • Lower CAPEX and running cost compared to competing processes

  • Plating on glass enabled by an ultra thin metal oxide adhesion promoter
  • Lower CAPEX and running cost when compared to competing processes, such as sputter
  • Applicable for panel as well as wafer scale
  • Single seed etching process resulting from Cu only seeding

Why we developed VitroCoat GI

Your challenge

The ideal material properties of Glass (scalability, high resistivity, low warpage, smooth surface) make it a key new substrate for advanced PKG.
Unfortunately, plated Copper does not adhere directly to glass without a capable adhesion promoter.
The major challenge is to provide a cost competitive, high throughput and reliable metallization for both TGV and smooth glass with excellent adhesion.

Our solution

VitroCoat GI is an ultra thin metal oxide adhesion promoter enabling plating on glass.
VitroCoat GI enables usage of electroless Cu for seeding and semi-additive processes with your EQP.

Unparalleled coverage in high aspect ratio through-vias

Atotech’s VitroCoat GI is a new and innovative adhesion promoter that enables wet chemical metal deposition on glass. It can be applied using a short, simple, cost effective dip-coating method.

VitroCoat GI’s key advantage is unparalleled coverage in high aspect ratio through-vias versus competing processes such as PVD.

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