InPulse 2 – The Low Cost Solution

Ever increasing demands for HDI production processes call for innovative, future-oriented solutions. The new InPulse 2 copper plating system extends the limits of horizontal plating technology to a new dimension. With its full range of major technical improvements like minimum anode/cathode distance, wide area contact system segmented anodes and matching electrolyte InPulse 2 is well prepared for tomorrow's plating challenges.

Advanced Solutions for Acid Copper Plating

The Inpulse 2HF electrolyte together with the Uniplate InPulse 2 is ideally suited for blind micro via filling. The process enables "Super Filling" which gives unrivalled productivity and blind micro via filling with half the copper plating thickness in comparison to standard processing.

Standard BMV Filling		'Super Filling'
30 µm Cu plate Plating time > 60 min		15 µm Cu plate Plating time approx. 30 min
Savings		Features
50% less Cu plating Soldermask Etching chemistry Processing time 50% less Cu plating		50% less Cu plating Soldermask Etching chemistry Processing time 50% less Cu plating

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