InPro Plating System

InPro electrolytes are designed to operate in vertical equipment using insoluble anode systems with copper oxide replenishment of the plated copper. The insoluble anodes provide a constant anode surface and therefore constant surface distribution. Maintenance is reduced because no anode sludge is generated and no time consuming refill of baskets/ change of bars is necessary. InPro electrolytes are designed for use with force flood agitation for high productivity at high current densities. Process additives may be controlled with standard analysis procedure based on CVS for simple maintenance.

Conformal Plating with InPro A200

The InPro A200 process gives excellent throwing power especially with BMV's at high current density operation at up to 3.5 A/dm²

• Ideally suited for high productivity in panel or pattern plate mode.
• Plated copper reliability meets all industry standards
• Optimal line shape in pattern plate application
• Simple process control for continuous high volume production
• Stable in operation and no harmful breakdown products are produced ensuring best process reliability
  
  

BMV Filling with InPro A300

InPro A300 is designed for blind micro via (BMV) filling at high current densities up to 2.5 A/dm².

• Gives reliable BMV filling with varying diameter and depth BMV's on the same panel
• Optimal BMV filling is achieved with relatively low surface copper plating
• Compatible with panel and pattern plating