NeoLink® – Reaching a New Milestone in Direct Plating on Plastics

2011, August – With Neolink®, Atotech has reached a crucial new milestone in direct plating on plastics. Much shorter and cost-effective than conventional plating systems for plastic materials, NeoLink®  ensures fast metal deposition on ABS and ABS/PC blends with no need for electroless Ni or Cu plating and Ni or Cu strike. Furthermore, the low palladium formulation (50 - 70 ppm) of NeoLink® Activator allows for minimized drag-out costs.

Unlike conventional plating systems, usually removing tin and tin chloride after activation in the accelerator step in order to expose palladium, NeoLink® replaces tin with copper. As a result, copper links to palladium, providing a high and stable electrical conductivity that allows for direct copper plating. Easily integrated in existing lines, NeoLink® immediately improves productivity and the reliability of the production.

NeoLink® meets the most demanding requirements of the automotive, sanitary, fashion and white goods industries worldwide.

NeoLink®

• No electroless Ni or Cu plating
• No Ni or Cu strikes
• Short process, higher productivity
• Less water consumption and easy wastewater treatment
• Increased yield
• No rack metallization
• Suitable for plating on ABS, ABS/PC