Pure Tin Plating

Reliable Tin Plating on Connectors

Reliable operation of the precious metal connector terminal is verified by the exceptional hardness and wear resistance of precious metals for all levels of coating thickness. The EU directives RoHS and WEEE demand the solderable joint to become lead-free. Pure tin layers of minimal internal stress and thus lower whisker propensity, whilst maintaining excellent solderability are essential for the industries' needs. Extensive whisker documentation and production proven solutions are key to achieving high confidence and acceptance levels. Robust systems allowing a wide variation of significant plating parameters assure the manufacturer of consistent and reliable results.
To complete this package a new effective anti-corrosion agent Protectostan LF has been designed, which mitigates corrosion whisker formation under heat / humidity storage conditions and prevents discoloration. As a consequence of this effective corrosion protection, the solderability improves significantly after steam aging and pressure cooker test.

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Typical process sequence with recommended products:

Tin Plating on IC Outer Leads

For tin plating on IC outer leads Atotech offers a complete package, ranging from deflash to belt-stripper, combining the benefits of low whisker risk and increased process efficiency. StannoPure® HSM ST provides a lead-free solderable finish on IC outer leads, satisfying all iNEMI/JEDEC whisker specifications. It is approved and applied by leading IC assembly houses. With StannoPure® HSM ST big grain tin deposits with a flat morphology are achieved as an ideal solution to create deposits of low whisker propensity, excellent solderability, and good properties for trim and form.

Typical process sequence with recommended products: