Au and Au Alloys
Process | Features & Benefits | Connectors | Leadframes | IMDS | |
|---|---|---|---|---|---|
Au Plating | Aurocor® K24 HF | Aurocor® K24 HF is a weakly acidic pure gold electrolyte for the deposition of solderabel Au layers that can be wire bonded. | X | 757906 | |
Aurocor® HS | Aurocor® HS is a weakly acidic high speed gold plating process for the deposition of bright, pure gold layers. It is especially designed for the selective and full gold plating of electronical and electrical parts in high speed galvanic installations, like reel to reel, for brush plating and jet-plating for layer thickness to up to 10 µm gold. | X | 758038 | ||
Au Alloys | Aurocor® HSC | Aurocor® HSC is a weakly acidic high speed gold plating process for the deposition of bright, cobalt alloyed gold layers. It is especially designed for the selective and full gold plating of electronical and electrical parts in high speed galvanic installations, like reel to reel, for brush plating and jet-plating for layer thickness to up to 10 µm gold. | X | 758038 | |
Aurocor® HSF | Aurocor® HSF is a weakly acidic high speed gold plating process for the deposition of bright, iron alloyed gold layers. It is especially designed for the selective and full gold plating of electronical and electrical parts in high speed galvanic installations, like reel to reel, for brush plating and jet-plating for layer thickness to up to 10 µm gold. | X | 758038 | ||
Aurocor® HSN | Aurocor® HSN is a weakly acidic high speed gold plating process for the deposition of bright, nickel alloyed gold layers. It is especially designed for the selective and full gold plating of electronical and electrical parts in high speed galvanic installations, like reel to reel, for brush plating and jet-plating for layer thickness to up to 10 µm gold. | X | 758038 |