Internepcon Show 2010

From January 20 - 22, 2010 Internepcon will be held in Tokyo, Japan.

As Asia's largest exhibitions the Internepcon features all kinds of Equipment, Technologies and Materials for Electronics Manufacturing and SMT.
Please feel invited to visit us at our booth and find out more about Atotech’s new technologies and developments roadmaps for IC Substrate and PCB Manufacturing.

Our highlights at the show are:

• Auxiliary Systems for Green Manufacturing (Atotech's latest Developments)
• Systems – Touchless Transportation System
• SolderFill - New Process Solution for Solder Bump Plating for Next Generation SRO
• Via² Process - Laser Embedded Conductor Technology
• Seleo CP Plus – Best Conductive Polymer Direct Metallization
• Stannatech Flex - Vertical Immersion Tin for Flex Applications
• Inpulse 2THF - The Best Choice for Through Hole Filling
• Secure HFz - Non-Etching Adhesion Promoter System for IC Substrates
• Protectostan LF – A Unique Post-treatment to Mitigate the Corrosion Whisker Formation
• Niveostan SL − Combining large Grains with semi-bright Appearance
• MoldPrep HMC – New Generation for MSL improvement
• Complete Process Solutions for
  - IC Substrate Carrier manufacturing
  - Advanced Packaging Technology in the field of Semiconductor

We are looking forward to see you at the Internepcon show in January and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2010.

For more information regarding the show, visit: www.nepcon.jp/inj/en/