SEMICON Taiwan 2010

20. August 2010

From September 8 - 10, SEMICON Taiwan 2010 will be held at Taipei World Trade Center in Taipei, Taiwan.

The show focuses on microelectronics manufacturing. SEMICON Taiwan presents products and information designing and manufacturing the future of semiconductors, MEMS, nanoelectronics, photovoltaics and related advanced electronics. Additionally there will be the 3D IC Technology Forum, where major industry players will share their experiences in 2.5D and 3D ICs especially emphasizing emerging business models, roadmaps and interdependencies with others.


Our highlights at the show are:

  • Everplate 45 nm Series - Copper Damascene Interconnects for sub-45 nm Node Plating
  • Spherolyte – Through Silicon Via Process
  • Xenolyte – Pad Metallization Process
  • Stannolyte - Immersion Tin on Copper Pillars
  • Niveostan SL – Matt Tin Plating Process Combining Large Grains with Semi-bright Appearance
  • MoldPrep HMC – New Generation Adhesion Enhancement for MSL Improvement
  • Products and Processes for Tin Plating on IC Outer Leads
  • Atotech's Complete Range of Processes for the Connector and IC / Leadframe Industries


We are looking forward to seeing you at the SEMICON Taiwan show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2010.


For more information regarding the show, visit:
www.semicontaiwan.org/SCTAIWAN-EN/index.htm

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