SEMICON Japan 2010

03. November 2010

From December 01 - 03, SEMICON Japan 2010 will be held at Makuhari Exhibition Center in Chiba, Japan.

The show focuses on microelectronics manufacturing. SEMICON Japan presents products and information designing and manufacturing the future of semiconductors, MEMS, nanoelectronics, photovoltaics and related advanced electronics. Additionally there will be a Next Generation Technology Pavilion where you can discover the latest developments in 3D Packaging, LEDs, and other technologies driving the future of microelectronics.

Our highlights at the show are:

  • Everplate 45 nm Series - Copper Damascene Interconnects for sub-45 nm Node Plating
  • Spherolyte TSV – Through Silicon Via Process
  • Xenolyte – Pad Metallization Process
  • Stannolyte - Immersion Tin on Copper Pillars
  • AntiEbo 13 – Post-treatment to Prevent Epoxy Bleed Out
  • MoldPrep HMC – New Generation Adhesion Enhancement for MSL Improvement
  • Niveostan SL – Matt Tin Plating Process Combining Large Grains with Semi-bright Appearance
  • Protectostan LF – A Unique Post-treatment to mitigate Corrosion Whisker Formation
  • Products and Processes for Tin Plating on IC Outer Leads
  • A Complete Range of Processes for the Connector and IC / Leadframe Industries


We are looking forward to seeing you at the SEMICON Japan show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2011.


For more information regarding the show, visit:
www.semiconjapan.org/en/index.htm

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