Advanced Substrates - RCF / RRCF - ADEPT Technology
Vialam MV 4020 is a halogen free mid Tg resin coated copper foil. It is built using Atotech's proprietary powder technology ADEPT. The product is solvent free and provides excellent drop test durability. It is mainly used in the HDI buildup construction for the mobile phone and wireless applications. It attains good thermal and electrical properties. The product has also withstood numerous reliability tests with excellent results (e.g. thermal cycling and MSL 3).
Advanced Dielectric Epoxy Powder Technology (ADEPT)
ADEPT is Atotech's proprietary and unique process for creating advanced dielectrics for HDI PCBs and IC substrates, principally RCF or RCC (Resin Coated Copper Foil/Clad), and RRCF (Reinforced Resin Coated Copper Foil). This manufacturing process eliminates the use of organic solvents, instead utilizing dry powders only.
Atotech's ADEPT process employs an extruded dielectric resin, which is then milled to controlled particle size and then applied directly onto the foil. A final melting/fusing converts the dry powder into a "B" staged laminating resin fully ready for use at the customer.
The technical benefits of ADEPT are:
- Wide selection of resin components in order to create dielectrics with ideal mechanical and electrical properties
- High flexibility in RCF, RRCF production allowing for economic manufacturing of highly specialized materials
- Thickness tolerances and control at 3x industry standards
The exclusion of organic solvents from the manufacturing process and therefore of the finished product benefits both the environment, by eliminating CO2 emissions, and also the final product performance since the volatile content is thereby reduced to zero.
Products in the ADEPT family are halogen free (JPCA-01-1999) and conform to UL 94 V0 requirements.
Solvent Free Powder Production Technology ADEPT
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