- MV 4020
VIALAM MV 4020 Series - RRCC
Vialam MV 4020 is a high Tg glass reinforced resin coated foil. It is designed for fine line processing in IC Substrate. Applications include smartphones, digital cameras, camcorders, and media tablets. The product comes in the form of a reinforced resin coated on copper. Ultrathin copper is being used with very low profile roughness for ease of etching. The low roughness and high peel strength characteristics of this product make it suitable for the modified semi additive processing. In addition, the coating thickness can be made very thin by the use of ultrathin glass fabrics such that it can be applied on coreless construction. The product is still in the development stage and samples can be made available for customer evaluation if requested.
General Features and Benefits
- High Tg resin system
- Ultrathin glass styles
- Low coefficient of thermal expansion
- Low water absorption
- High peel strength
Typical material properties of MV 4020 * (for details please contact our local or global sales staff)
(* using 1015 glass fabric, 70% RC)
MV 4020 | IPC TM-650 | |
|---|---|---|
Thermal Properties | ||
Tg (DSC) | 190°C | 2.4.25 |
Tg (DMA) | 194°C | 2.4.24.5 |
Decomposition Temperature (5% wt. loss) | 388°C | 2.3.40 |
CTE < Tg | 40 ppm / °C | 2.4.24.C |
CTE > Tg | 160 ppm / °C | 2.4.24.C |
CTE (X/Y, 40 - 270°C) (X-fill, Y-warp) | 16/17 ppm / °C | 2.4.24.5 |
Time to delamination T300 | > 30 min | 2.4.24.1 |
HPCT | Pass (Pass/Fail) | 2.6.16 |
Mechanical | ||
Young's Modulus | 4.90 GPa | 2.4.18.3 |
Tensile Strength | 127.00 MPa | 2.4.18.3 |
Elongation | 3.45% | 2.4.18.3 |
Peel Strength (12 μm Cu) | 0.76 N/mm | 2.4.9 |
Peel Strength after solder dip at 288°C (12 μm Cu) | 0.76 N/mm | |
Chemical | ||
UL Burning Test | TBD | UL 94 |
Water Uptake | 0.33% | 2.6.2.1 |
Electrical | ||
Dk (1GHz) | 4.36 | 2.5.5.9 |
Tan δ | 0.0218 | 2.5.5.9 |
Volume Resistivity | 8.70E+15 Mohmcm | 2.5.17.1A |
Surface Resistivity | 4.40E+13 Mohm | 2.5.17.1A |
Electric Strength | 154.3 KV/mm | IEC60243-1 (98) |
MSAP | ||
Cu Peel Strength (after plating up to 30 μm Cu) | 0.7 N/mm | 2.4.9 |
Ra after desmear (3/35 μm Cu) | 0.25 - 0.35 μm |
Material Availability
MV 4020 is available in different copper thicknesses, namely, 12 µm, 18 µm, 3/35 µm, 5/35 µm. Copper foils used are according to the IPC 4562 Grade 3 standard. The ultrathin copper foils are also equipped with VLP (very low profile) and HTE (high temperature elongation) properties.
Standard Cu thickness:
Thickness | Weight | IPC Code |
|---|---|---|
12 μm | 1/3 oz | T |
18 μm | 1/2 oz | H |
Special Cu Thickness (upon special requests from customers):
Thickness | IPC Code |
|---|---|
2/35 μm | |
3/35 μm | |
5/35 μm | E/1 |
MV 4020 comes with a dielectric thickness range of 30 to 50 µm at increments of 10 µm. Other copper foil or dielectric thicknesses can also be made available upon customer's request.
Copper Foil: Grade 3, VLP | 3/35, 5/35, 12, 18 μm |
Glass Type: 1015/1027/1037 | 30 to 50 μm |
Storage Conditions
Condition 1 | Condition 2 | |
|---|---|---|
Temperature | < 23ºC | < 6ºC* |
Humidity | < 50% | |
Shelf Life | 180 days from delivery | > 180 days from delivery |
* Note : Material should be stored in unopened bags for 24 hours at ambient temperature before use.