Via-hole fillers are used to close holes (tenting) to prevent the penetration of solder during the assembly process and to improve the reliability of PCBs. The SD 2361 series is a solvent free system and therefore prevents the formation of solvent bubbles or voids in the filling.

Via Hole Fillers Application

Thermal curing via-hole fillers of the SD 2361 series are usually applied after the Soldermask process and preferably after the Surface Finish process.

Via Hole Fillers Features and Benefits

• Excellent paste adhesion to Cu in via
• Reliable filling of all holes typically up to 0.8 mm
• Stable during soldering, wet or vacuum processes (no penetration of and substance through the holes)
• Avoid flux residues in via holes
• Ensure proper conditions for in-circuit electrical tests
• Especially qualified and used for automotive boards with high safety standards

Overview most important Products (for details please contact our local or global sales staff)

Via hole fillers, manufactured by Lackwerke Peters, distributed and serviced in Asia by Atotech.