Atotech supplies Uniplate equipment and specially adapted chemistry for electroless copper deposition in horizontal application. Our state of the art horizontal P / LB Uniplate systems are developed to deliver best results with minimum chemistry consumption thus greatly mitigating the environmental impact and reducing process costs.

Product Overview

Printoganth SAP Plus process chemistry in combination with Uniplate equipment gives superior adhesion on bare resins coupled with an extremely good surface distribution. This makes it the ideal choice for IC Substrate production.

Printoganth U Plus gives you extremely good copper to copper adhesion even under severe thermal shock conditions. This makes it ideal for production of high layer count PCBs with multiple inner layers. Printoganth P Plus has the best possible adhesion on smooth surfaces. It is thus the best choice for production of advanced base materials such as BT, PCF and PTFE. Its unique non blistering properties also predestine it for flex / flex-rigid applications. A temperature-adjustable deposition rate is an additional benefit of Printoganth P Plus. Atotech also offers dedicated horizontal conveyorized Uniplate production equipment for reel-to-reel flexible panel production.

Semi Additive Process (SAP)

As two components of an integrated system solution Printoganth SAP Plus chemistry is perfectly tailored for use with Uniplate Touchless Transport System (TTS) production lines. Both systems were developed to meet the demanding challenges of horizontal production of bare laminates.

The Printoganth SAP Plus Process

• Environmentally friendly, cyanide-free tartare bath
• Ionic activation with with limited palladium residue issues enables high end fine line application
• Special additives result in unique fine crystalline low stress deposit that give you unparralled non-blistering performance
• Horizontal conveyorised Uniplate touchless transport system (TTS) for best quality

Features and Benefits:

• Superior surface distribution vs. vertical PTH
• Very good throwing power in blind microvias allows for lower deposit thickness
• Special "contactless" panel transportation
• Perfectly suited for highest density packaging (lines / spaces)
• Higher throughput than vertical process
• Homogeneous plating environment with easy control of key parameters
• Auxiliary systems allow partial or total process control

Advanced Materials and Flex/Flex-Rigid Applications

Printoganth P Plus gives you best possible adhesion and no blistering even on the smoothest surfaces. It is the best choice for HDI, MLB and Flex /Flex – Rigid production with challenging and standard base materials.

The Printoganth P Plus Process

• Horizontal conveyorised Uniplate LB production equipment system for best quality
• Superior surface distribution enables low copper thickness – 0.35 µm is enough for most applications
• Environmentally friendly, cyanide-free tartare bath
• Ionic activation enables high end fine line application with no tooling hole or palladium residue issues
• Also Suitable for MSAP and AMSAP application
• Special additives result in unique fine crystalline low stress deposit that give you unparralled non blistering performance

Features and Benefits:

• Superior adhesion on advanced and flexible substrates such as high Tg FR4, polyimide, BT and PTFE
• Process flexibility through easy adjustment of deposition rate between 0.35 µm to 0.50 µm in 4 min
• Very high throwing power in through holes and blind microvias
• High process stability and highest reliabilty performance

Standard Materials, High Layer Count PCBs and Stacked Via Build Up

Printoganth U Plus enables enhanced copper-to-copper adhesion between the electroless copper deposit - inner layer, capture pad and galvanic build up - copper layers. This makes Printoganth U Plus the best horizontal process for most reliable production of high layer count PCBs as well as for stacked via production. It is an improvement on the well established production proven Printoganth U process, which has an installed production capacity of over 25 million m²/yr worldwide.

The Printoganth U Plus Process

• Horizontal conveyorised Uniplate LB production equipment system for best quality
• Superior surface distribution enables low copper thickness – 0.35 µm is enough for most applications
• Special stablizer additives for unparralleled Cu-to-Cu adhesion
• Ionic activation with limited palladium residue issues enables high end fine line application with
• Environmentally friendly tartrate based electroless copper
• Medium speed 0.35 µm in 4 min

Features and Benefits:

• Extremely good copper-to-copper interconnection, which can withstand extreme conditions (9 x 288°C solder schock)
• Favourable stress characteristics, fine grain deposit for good ahesion