Vertical Electroless Copper Plating Module
Vertical Product Application Guide
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Printoganth MV Plus electroless copper deposit on ABF GX13 after annealing
Printoganth PV E electroless copper deposit only - very good coverage throwing power in challenging BMV
Noviganth LS Plus

Vertical Electroless Copper

Atotech has over two decades of experience with vertical electroless copper plating in the PCB industry. We offer technologically advanced, cost effective processes for SAP, HDI, MLB and Flex / Flex-Rigid applications.

Product Overview

Printoganth MV Plus is a production proven process, which provides the best answer to the technological challenges of electroless copper deposition for production.
Printoganth PV E is a low to medium build process that was developed to achieve best results for HDI and MLB production. The good adhesion and non blistering behavior that is achieved with Printoganth PV E is unparalleled on the market. This makes it the ideal choice for production of high Tg and other "sophisticated" materials.
Noviganth LS Plus has been optimized for maximal cost benefit. It has a dedicated desmear process that offers maximum performance at minimum cost.

Semi Additive Process (SAP)

Printoganth MV Plus is the vertical electroless copper process that is mass production proven to best fulfill the demands of semi additive processing (SAP). Auxillary systems for automatic total process control ensure constant, reliable perfomance with maximum safety.

The Printoganth MV Plus Process

  • Best Process for SAP, MSAP and AMSAP with ABF, BT PCF and other modern materials
  • Special pretreatment and ionic activation for best coverage with minimum residual palladium
  • Electroless copper deposit for blister-free deposit with good surface distribution

Features and Benefits

  • Low compressive stress ensures blister-free deposition on typical SAP substrates
  • Unique ionic activation leads to good coverage with minimal residual palladium and low residual conductivity, enabling fine line technology
  • Special additives achieve good glass coverage resulting in maximal flexibilty - reliable production of both SAP and FR4 substrates in same line
  • Environmentally friendly process – cyanide free stabilizer and EDTA free system
  • Automated complete process control ensures constant, highly reliable performance with maximum safety

 

Advanced Materials and Flex/Flex-Rigid Applications

Printoganth PV E is a vertical electroless copper process that gives you exceptionally good coverage and adhesion combined with highest reliability even on the most demanding base materials.

The Printoganth PV E Process

  • Environmentally friendly tartrate based cyanide-free process
  • Low stress deposit with unique copper crystalline deposit structure
  • Ionic activation results in minimal palladium residues mitigating tooling hole plating issues
  • Robust process with constant performance and prolonged lifetime

Features and Benefits

  • Superior adhesion on most materials including high Tg FR4, Polyimide, PTFE and BT
  • Cost effective
  • Deposit speed of 0.5 - 0.6 µm in 10 min
  • Low to medium build process
  • Very good throwing power in blind microvias and through holes

 

Standard HDI and MLB

Noviganth LS Plus offers a good balance between cost-effectiveness and product reliability. It is easy to handle and very robust, which predestines it for high volume production of low to medium technology PCBs.

The Noviganth LS Plus Process

  • EDTA based process
  • Cyanide free activator
  • Ionic activation results in minimal palladium residues mitigating tooling hole plating issues

Features and Benefits

  • Highly cost effective
  • Very robust and reliable process
  • Easy handling
  • Deposit speed of 0.5 - 0.6 µm in 10 min
  • Robust process with constant performance and prolonged lifetime