Cerabond M: Plating on Ceramics

When electronic devices are exposed to a hot and humid environment as found under the hoods of cars the most suitable material is ceramics.
The commonly used technology for ceramic multilayers is 'Low Temperature Co-fired Ceramics' (LTCC). Up to 50 layers can be stacked one upon another. Ceramics are also used for high frequency application.
In order to get a solderable and wirebondable surface either standard thickfilms or NiPdAu (CeraBond M) on silverpaste as final finish are applied.

Cerabond M is a Ni-Pd-Au process especially designed for plating on ceramic substrates as used for integrated devices for automotive electronics.
The Cerabond M layer is suitable for Au-wire bonding, Al-wire bonding and conductive adhesive interconnect technologies.