Schercoat OSP on PCB
Schercoat OSP: Process Sequence

Schercoat OSP: Organic Solderability Preservative

OSP is a popular surface finish for soldering due to its low cost, easy handling, low temperature processing and environmental friendly and metal free chemistry. Depending on the application the appropriate OSP process can be chosen.

 

Schercoat Plus Lead Free and Schercoat Plus SIT show consistent wetting performance versus dry heat and humidity at high temperatures

Wetting Balance Performance

IR-Reflow conditions:

  • Schercoat Film: 0.20 ~ 0.25 µm target
  • Pre-heat: 150 ~ 180°C / 112 sec
  • Peak temp.: 251.3°C
  • Nitrogen atmosphere; Oxigen 100 ppm
  • Over 200°C: 56.3 sec
  • Reflow oven instrument: Asahi-Electronics BA-250C


Humidity loading conditions:

  • Temp.: 40°C
  • Humidity ratio: 90%
  • Time: 96 hrs.

 

Features and Benefits of Schercoat Plus
(Standard OSP)

  • Basic OSP version
  • Pass on time Pb-free soldering under nitrogen atmosphere
  • Pass multiple Sn-Pb soldering
  • Horizontal

 

Features and Benefits of Schercoat Plus Lead Free
(High Temperature OSP)

  • Multiple Pb-free soldering under nitrogen atmosphere
  • Advanced wetting perfomance
  • Horizontal

 

Features and Benefits of Schercoat Plus SIT
(High Temperature OSP)

  • Multiple Pb-free soldering under nitrogen atmosphere
  • Advanced wetting perfomance
  • Covers only copper areas, gold area remain uncovered
  • Horizontal