CPCA Show 2011

17. February 2011

From March 15 - 17, CPCA 2011 will be held at Shanghai New International Expo Center (SNIEC) in Shanghai, China.

This years CPCA Show covers the complete spectrum of the electronics industry from components to manufacturing equipment. Attractive synergies are created through the wide range of exhibiting companies including exhibitors from the following segments: manufacturing equipments and logistics, chemical providers, semiconductor, MEMS, assemblies and subsystems, displays, test and measurement and many more.

The latest breakthrough technology will be presented for future-oriented markets such as automotive, telecommunication, consumer electronics, industry applications and IT products.

The accompanying International Conference will be held concurrently with the fair and will concentrate on current trends and developments with significant impact for the Chinese electronics market. We will present two papers on the following topics:

  • The Advantages of pure Palladium - ENEP and ENEPIG for Flexible PCB's
  • Leading the Change to Green Plating Technologies

Our highlights at the show:

  • Printoganth P Plus - Best Horizontal Electroless Copper for High End PCBs
  • Seleo CP Plus - Best Conductive Polymer Direct Metallization
  • InPro A200 - High Performance Copper Plating in Vertical Conveyorized Equipment
  • Inpulse 2HF - The Low Cost Solution for Blind Micro Via Filling
  • BondFilm XP - Oxide Replacement Process with Enhanced Adhesion Performance
  • CupraEtch DT - New Improved Photoresist Adhesion Process
  • Universal Finish SolderBond (ENEPIG and ENEP) for Soldering, Au-Wire and Cu-Wire Bonding  
  • Schercoat - OSP Series
  • Metallization on Glass-Substrates - Versatile Process for Future Applications
  • Additive RFID Antennas
  • Imaging Resists and Specialty Lacquer Products
  • VIALAM Series - Advanced Dielectrics and Substrates
  • New Systems Technologies
    - TTS - Touchless Transport System
  • Complete Process Solutions for
    - Flex / Rigid-Flex PCBs
    - HDI Board Manufacturing in Mobile Phones
    - Multilayer Board Manufacturing

We are looking forward to seeing you at the CPCA Show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2011.

For more information regarding the show, visit: www.cpcashow.com/en/

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