IPCA Show 2011

From August 3rd - 5th, IPCA 2011 will be held in KTPO, Trade Centre, in Bangalore, India.

This year the motto of the IPCA Show is "Be part of the fast growing economy". Companies of the entire industry will participate starting from PCB designers and manufacturers to suppliers of raw material and equipment, CAD/CAM software and service providers as well as EMS and many others.

During the three days the innovative products and state-of-the-art-technology will be presented in all fields of manufacturing in Bangalore, the silicon valley of India.

The accompanying technical seminars will be held concurrently with the fair on August 3rd and 4th and will concentrate on advanced PCB & Assembly Technologies, leading edge base materials and HDI & Flexible circuits for the handheld market.

Our highlights at the show:

• Printoganth PV E - Vertical Electroless Copper for Demanding Substrates
• Seleo CP Plus - Best Conductive Polymer Direct Metallization
• Cupracid CV2 - Vertical DC Plating for Vertical Conveyorized Systems
• Cupracid TP / TP1 - The New Benchmark for DC Technology
• BondFilm - Oxide Replacement Processes for Advanced Applications
• CupraEtch DT - New Improved Photoresist Adhesion Process
• Schercoat - OSP Series
• AuNic - Dummy-free Plating Economic Mid-Phosphorous ENIG Process
• Additive RFID Antennas
• VIALAM Series - Advanced Dielectrics and Substrates
• Imaging Resists and Specialty Lacquer Products
• Xenolyte - Pad Metallization Process
• Complete Process Solutions for
  - HDI for Mobile Phones
  - Multilayer Boards
  - Immersion Tin

We are looking forward to seeing you at the IPCA Show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2011 and the upcoming years.

For more information regarding the show, visit: www.ipcaexpo.com