TPCA Show 2011

20. October 2011

From November 9 - 11, TPCA Show 2011 will be held at Taipei Nangang Exhibition Center in Taipei, Taiwan.

This years TPCA Show covers the complete spectrum of the electronics industry from materials and technologies of the PCB, electronics and assembly industries as well as comprehensive equipment. Sustainability is getting an ever-increasing focus. Therefore various green equipment, technologies and materials will be presented for saving energy, reducing carbon emissions and pollution. The TPCA has become the second largest international PCB show in the world that attracts worldwide buyers every year.

The accompanying International Conference will be held concurrently with the fair and will concentrate on current trends and developments with significant impact for the Taiwanese electronics market. Atotech will be present and provided seven very interesting papers on the following topics:

  • Palladium Surface Finish for Copper Wire Bonding
  • Subtractive Structuring of Fine Line Build up Layers
  • Laser Embedded Circuit Technology (Via²) – A Comprehensive Wiring Solution for Advanced IC Substrates in the Sub-10mm L/S-range
  • Green Palladium Remover for the Future of PCB Manufacturing
  • Interfacial Bonding Strength and Reliability of Au Wire on Ni-P/Pd and Ni-P/Pd/Au Surface Finish Processes
  • Organic and Printed Electronics – An Experimental Approach to the Development and Application of New Technologies
  • Uniplate TTS – The New Touchless High Volume Production Technology

 Our highlights at the show:

  • Printoganth P Plus – Best Horizontal Electroless Copper for High End PCBs
  • Printoganth SAP Plus – Pioneering Horizontal Electroless Copper Process for IC Substrate Production
  • InPro A300 – BMV Filling in Vertical Conveyorised Equipment
  • Inpulse 2HF – The Low Cost Solution for Blind Micro Via Filling
  • Inpulse 2THF – Through Via Filling for IC/CSP Substrate
  • CupraEtch DE – Differential Etch for SAP/MSAP
  • Secure HFz – Non-Etching Adhesion Promoter for High Frequency and Packaging Applications
  • Universal ASF II (ENEPIG & ENEP) for Soldering, Au-Wire and Cu-Wire Bond
  • Aurotech Flex M – Flexible ENIG with Improved Bending Performance
  • Metallization on Glass-Substrates – Versatile Process for Future Applications
  • High Density Integration by Embedding Chips for Reduced Size Modules and Electronics Systems
  • APR DI – Liquid Photoimageable Etch Resist for Laser Direct Imaging
  • VIALAM Series – Advanced Dielectrics and Substrates
  • New Systems Technologies
    - TTS - Touchless Transport System
    - UTS-xs – Universal Transport System for Flex Foils and Ultra Thin Material
  • Via² Process – Laser Embedded Conductor Technology
  • SolderFill – New Process Solution for Solder Bump Plating for Next Generation SRO

We are looking forward to seeing you at the TPCA Show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2011 and 2012.

For more information regarding the show, visit: www.tpca.org.tw

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