System Solutions for Panel and Pattern Plating
Atotech has advanced the concept of plating technology within the PWB industry to a new level by developing and pioneering horizontal copper plating. This technology is now at the latest stage with Uniplate InPulse 2 the complete solution for all aspects of HDI production from conformal high current density production to copper filling of blind micro vias and through holes.
Atotech offers system solutions with Uniplate InPulse equipment and also technology for vertical plating in pulse or DC mode for conformal plating and also for the filling of blind micro vias.
Electrolytes and the corresponding pre-treatment are available for copper and tin as well as for electrolytic nickel and gold, the correct solution is available for each and every application.
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