Aurotron for high performance Bond and Hard Gold

Atotech offers electrolytes for bonding and hard gold applications with wide operation ranges and highest quality.

Aurotron H - Hard Gold Processes

Aurotron H 200 is suitable for applications subjected to mechanical wear for example sliding contacts and connectors. Aurotron H 200, bright cobalt alloyed hard gold, is designed for a high deposition rate while offering excellent characteristics. The cobalt has a hardening and brightening effect. The plating process has a wide operating range and the deposition rate is easily controllable.

• Good wear resistance and excellent characteristics against mechanical abrasion
• Low contact electrical resistance and also good solder wetting
• The gold content in the deposit is 99.6 to 99.9% with uniform alloy composition
• Aurotron H 200 gold deposit alloyed with cobalt, characteristic hardness 170 - 190 HV
• Aurotron H 300 gold deposit alloyed with nickel, characteristic hardness 240 HV
• The deposition rate is between 0.3 µm/min to 1µm/min and thick gold layers can be deposited without cracks

Aurotron B 100 - Bond Gold Processes

Aurotron B 100 is used for gold and aluminium wire bondable surfaces for chip carrier or chip on board applications and protects the nickel deposit (Nikotron M 100) against corrosion, the deposit  thickness is  in the range up to 1 µm. The electrolyte is free of Arsenic and Hydrazine and has a excellent lifetime resulting in low maintenance costs.

• Pure gold (99.99% pure) deposit for aluminium or gold wire bonding meeting all industry requirements
• Excellent solder spread results with lead free solder
• The deposit meets all environmental standards
• The electrolyte is arsenic and hydrazine free
• Wire bonding meets MIL STD - 833F Method No. 2011.7 over wide operating range and with a gold deposit thickness from 0.1 µm to 1.5 µm
• The plated surface meets ball shear tests according to JEDEC 22B117A
• The plated deposit meets ASTM B 488 - 01 Type I Grade C and II D all Classes