Nikotron for High Performance Nickel Plating

Atotech electrolytic nickel processes are available as sulphamate base or sulfate base.

Nikotron is a special nickel electrolyte developed for deposits with a high ductility and low internal stress. The deposits are designed for subsequent plating with gold and gold alloys. The process is easy to operate: all components can be analyzed with standard techniques. The electrolyte chemistry is stable over long periods of operation.

Nikotron M 100

• Sulphamate type nickel electrolyte
• Softer, more ductile and lower internal stress compared to sulfate system
• Ductility of Nikotron M 100: 15 %, dependant on plated thickness
• Superior throwing power compared to sulphate electrolyte
• Controllable deposit stress using special additives
• Controllable hardness
• Bright deposits achievable
• Highest purity in plated deposit

Nikotron S 210

• Watts type nickel sulphate electrolyte
• Active nickel surface due to low additive content
• Low organic incorporation results in nickel deposit with high ductility
• Semi bright Nickel layer
• Hardness depending on plating conditions and additive concentration
• Ductility in range 2-10 % depending on plating conditions and additive concentration