Inpulse IP2


BMV Filling with Through Hole Plating:

Horizontal BMV Filling

 

InPulse 2 - Technologies for Via Filling with Conformal Plated Through Holes

Implementation of via in pad technology is driven by the necessity of even tighter spacing of ball grid arrays (BGAs). With reliable BMV copper filling, via in pad technology on high density PCB designs can be achieved with simultaneous elimination of assembly issues such as solder voids and solder joint reliability issues. Chemistry entrapment is prevented, eliminating contamination of solder joints or possible corrosion. Other design benefits include thermal management enhancement and benefits for high frequency circuitry. With the development of sequential build up (SBU) as a viable multilayer printed circuit manufacturing technology, filling microvias with copper allows the use of stacked vias and via in pad designs. The final result of BMV copper filling is an overall improvement in long term reliability of the PCB including the packaging and assembly operation and therefore the complete electronic package.

InPulse2 equipment is particularly suited for filling technology as the working conditions in the equipment are very well controlled giving uniform plating results.

 

Inpulse 2HF - Blind Micro Via Filling

The Inpulse 2 system is production proven for BMV filling with simultaneous conformal plating of through holes. The combination of the Atotech inert anode / redox system and the InPulse 2HF electrolyte ensures long lifetime in full production. The process can be used for BMV-filling with simultaneous through hole conformal plating or for BMV-filling alone.

The InPulse 2 equipment together with Inpulse 2HF offers the best combination for HDI blind micro via filling:

  • Excellent surface distribution in the InPulse 2 allows uniform BMV filling distribution
  • Stable electrolyte giving the longest electrolyte lifetime system in production
  • Capable for BMV filling and also through hole conformal plating
  • Plated copper deposit meets all reliability standards for filled BMV
  • Higher current density filling process in comparison to vertical technology

Where only blind micro vias are filled the system offers a significant advantage in the patent applied "Superfilling" process.

Read more in our pages about: Horizontal Superfilling