Horizontal Through Hole Filling

Inpulse 2THF

Filling of through holes with electrolytic copper is a new capability which can replace current resin plugging processes. Inpulse 2THF reduces process steps required for filling and can significantly reduce costs and increase yields.

Filling through holes with copper gives improved thermal characteristics and also CTE matching in comparison to standard techniques. The process is a single treatment wet to wet metallisation and filling which means reduced handling and improved yields.

The Inpulse 2THF electrolyte together with the unique Uniplate InPulse 2 System is ideally suited for through hole filling especially for thin core material with copper foil thickness less than 5μm.

Benefits of the Inpulse 2THF System

• Through hole filling with minimum surface plated copper
• Excellent surface uniformity
• Through hole metallisation and electrolytic copper through hole filling in one conveyorised process line
• Process capable for core material of 50μm with copper foil ≤5μm thickness
• Allows 2 mil line and space technology
• Improved reliability, CTE mismatch eliminated
• Deposit plated with the Inpulse 2THF system meets all current reliability standards
• Dramatically reduced costs compared to conventional plugging technology
• Economical process savings in: copper metal, soldermask, etching process and processing time