- GX13 after typical pattern ablation - Courtesy Amkor
- Laser ablated material cross section with trench filling using Via²
Via² Technology - Copper Trench Filling for Ultra Fine Lines
Via² is an innovative technology that utilizes laser ablation techniques, together with specially developed plating processes, to form electrical paths for signal propagation within the dielectric, as opposed to conventional lithography based technologies that form signal paths on the surface of the dielectric layer.
Via² offers:
- Reduced number of process steps -> reduced environmental impact
- Reduced number of vias and layers in the IC substrate -> cost reduction
- Optimized electrical performance -> potential for design miniaturization
The tremendous growth and need for a new technology direction in the flip chip package sector, has fuelled the collaborative effort between Amkor Technology, their suppliers and Atotech to reach a breakthrough in substrate manufacturing techniques. A close look at this technology reveals the clear benefits and opportunity for significant gap closure required by the chip packaging industry today.