Tin Metal Resist

For vertical plating systems Sulfotech additives can be used in either sulphuric acid or methane sulphonic acid base electrolyte under DC plating conditions and also with Eductor agitation. The tin deposits produced are fine grained and exhibit good etch resistance characteristics.

Tin pulse electrolytes offer all the advantages of pulse plating, higher productivity through high throwing power and improved metal surface distribution which together with high operating current density gives significant cost savings.

Stannospeed tin electrolyte for horizontal application in Uniplate Sn offers a solution for tin tent production of fine lines and gives the capability to reduce the annular ring to a minimum.

Metal Resists For all Applications

Sulfotech for DC tin plating / Tinpulse for pulse plating, all Atotech metal resist electrolytes are outstandingly suited for depositing etch resistant layers. This is where they show their strength. Even layers as thin as 4µm can provide reliable etch resistance.

Read more on our pages about:

• Vertical Tin Plating
• Horizontal Tin Plating