Horizontal Tin Plating

Stannospeed
Horizontal electrolytic tin based on methane sulphonic acid electrolyte for tin tent applications

As an alternative to conventional film tenting techniques with panel plated copper substrates the system enables landless hole design and avoids the problems related to poorly tented holes.

Features and Benefits

• Uniplate Sn operates in pattern plate mode and uses soluble anode technology.
• Good tin thickness distribution with high aspect ratio blind micro vias
• Uniform tin coverage and subsequent etch resistance.