Vertical Systems

DC and Pulse Copper Plating

Atotech electrolytes for the highest requirements in reliability and productivity, designed for wide operating conditions and ease of use with complete analytical control.
Complete processes for vertical systems are available for high volume production at high current densities as well as for the production of high layer count material at low to medium current densities in DC and also pulse plating.

Modified electrolytes are also in full production for blind micro via filling of IC Substrates and HDI applications.

Atotech's DYNAPLUS Line for Vertical PCB Production

High Productivity and Reliability with quality made in Germany.
Pretreatment equipment in full panel / pattern plating mode capable also for tin metal resist plating.

Features and Benefits

Copper plating and also tin for pattern plating is available with pulse or DC rectifiers.
To reduce cycle time and line length Atotech offers a transporter incorporating rinsing, the rinse cycle is completed during the movement of the transporter over the plating line.
Floating shields guide panels during mechanical agitation and incorporate shielding for the electrolytic processing steps to ensure optimal plated surface distribution.
A special top clamp system allows high current density plating with automatic loading of the panels, this means higher productivity and reduced metal stripping of clamp contacts.

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