Pre-treatment - Acid Cleaners and Microetch

CupraPro - High-Performance Cleaning Prior to Copper Plating

CupraPro pre-treatment ensures complete deoxidation of the copper surface together with wetting of the finest structures due to the low surface tension wetting agents used, the cleaners are easily rinsed and are compatible to all commonly used metallisation processes. CupraPro acid cleaners have a surface tension comparable to that of the high performance copper electrolytes used today, and are suitable for both panel and pattern plating. Especially demanding applications such as the pre-treatment for IC Substrates may be reliably treated using CupraPro.

Biodegradable Acid Cleaners to Meet New Environmental Demands

CupraPro S2 (EU) pretreatment  meets the current standards for biodegradability for cleaners now required in the EU.
The acid cleaner has been specially developed to meet the new regulations whilst maintaining the high performance of the CupraPro pretreatment processes for panel and also pattern plating applications.

Securiganth Microetch Processes

The combination of CupraPro acid cleaner together with Securiganth etch cleaner ensures best possible surface preparation.
The etch cleaner can be used for both panel and pattern plating where resist residues are removed from track areas without any attack on the plating resist, Atotech etch cleaners contain no complexing agents.
Oxide layers are removed from the copper surface which is also micro roughened to aid adhesion of the next plated layer.
The etch cleaners do not utilise hydrogen peroxide so there is no danger of gas bubble formation at the substrate surface.
Securiganth C gives a consistent low etch rate with resulting ideal surface topography.