Innerlayer Bonding Processes

System Solutions for Advanced Surface Treatment

As the electronics industry continues to develop and the drive for miniaturization increases, the demands put onto modern Printed Circuit Boards and IC Substrates increase dramatically.  In addition to this, the need for more environmentally sensitive products and processes further increases the requirements on modern manufacturing technologies.  

Historically, surface modification or treatment processes have been regarded as the low technology end of the PCB wedge, however as the industry begins to demand more performance, the function of surface treatment has become paramount in board manufacturing. No longer will the simple generic chemistries guarantee high manufacturing yields with high technology performance and Atotech Surface Treatment Technology offers proven and viable solutions to current and future problems.

The Atotech Surface Treatment Technology solutions ranging from bonding enhancement, advanced surface preparation, photo resist developing and stripping to metal resist stripping.

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