Advanced Surface Preparation

As the technology demand increases, the thermo mechanical stresses applied to photo resists and solder masks increases, finer line and spaces means increased risk of damage during processing, and Pb free reflow temperatures and finer solder dams risk increased failure in service. Atotech offer a range of products maximize the adhesion of resists, and other products to modify the surface characteristics to maximize production capacity while also offering improvements in technical capability

FerroEtch

Atotech's FerroEtch is a unique process for improving the adhesion of photo resists and soldermask during the production of printed circuit boards. FerroEtch is designed to form uniformly micro-roughened copper surfaces, providing the ideal topography for enhancement of photoresist and soldermask adhesion. With the increasing complexity of the board circuitry, including ultra-fine line / space and microvia technology; the use of novel selective finish techniques, proper adhesion to photoresist and solder masks is essential. Altogether, use of FerroEtch will result in improved yields and lower production costs.

CupraEtch

For high-density circuit imaging, Atotech has introduced CupraEtch. The highly defined and uniform copper surfaces achieved with CupraEtch provide consistently improved adhesion of the photo resists and solder masks. The result is unsurpassed sidewall definition during developing for defect-free etching and plating. CupraEtch is offered as a total system with process equipment, chemistry and controls specifically developed for this application.

Secure HFz

In addition to enhancement for dielectric bonding, Secure HFz also offers excellent adhesion for soldermask materials. The same non etching process used for IC Substrate manufacture gives the same adhesion promotion mechanism on solder masks, further guaranteeing that the final line has exactly the same geometry as it did when it was first formed.

BondFilm LDD

With the advent of Laser Direct Drilling, the market proven BondFilm series has been extended in order to maximize CO2 laser absorption and ensure improved direct laser drilling. In addition to improved laser absorption, the BondFilm LDD process gives consistent hole size, reduced "Copper Splash" and with less undercut. The organo metallic layer has been re-optimised to ensure no loss of mechanical or chemical properties, thus allowing BondFilm LDD a dual use in laser drilling and multilayer assembly, meaning a single production line for two production processes.

Read more on our pages about: