BondFilm LDD

The BondFilm LDD Solution is the principal treatment step in Atotech's prior to the laser direct drilling process. Following the BondFilm Activator step, the exposed copper is treated in BondFilm LDD Solution to create the desired uniform, brown, organo-metallic conversion coating. The resultant surface topography ensures improved laser energy absorbance for CO2 lasers. The mechanical and chemical characteristics of this surface result in excellent peel strength while providing resistance against chemical attack in subsequent processing.

Although BondFilm LDD Solution has been developed for horizontal conveyorized application, vertical processing will provide equally excellent results.

Features and Benefits

• Improved laser energy absorbance of the copper surface
• Consistent Hole Size
• Reduced Copper Splash
• Less Undercut
• Available as a complete system with Atotech's Horizon process equipment