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Bonding Enhancement
Traditionally Reduced Black Oxide processes were used as the primary pretreatments prior to multilayer lamination and bonding. However with their limited capacity, "pink ring" and easily damaged oxide layers, those were readily replaced with the more technically adapt Alternative Oxide process. With their long term experience in both areas, Atotech offer MulitBond Reduced Black Oxide and the BondFilm family of products.
Multibond
Multibond Black Oxide Process is a simple process for improving the bonding characteristics of inner layers, used in multilayer PWB manufacturing. The Multibond process can be operated over a wide range of temperatures and dwell times to produce a variety of bonding properties, depending on the specific applications. The flexible system allows the process to be "customized" to meet different bonding requirements. When used in combination with Atotech's Multibond SR stabilized reduction solution, multilayer defects such as "pink ring" and wedge voids can be virtually eliminated.
BondFilm
BondFilm is Atotech's simple, economic process for improved inner layer bonding. The organo-metallic surface combines inner layer adhesion with optimized chemical resistance. BondFilm is a production system, with chemistry and equipment developed simultaneously. It meets key function needs as thinnest material transport, solution delivery and chemistry maintenance. The result is the only truly "package" system for bonding enhancement in the PCB industry.
Secure HFz
Secure HFz is the next generation of adhesion enhancement targeted for IC substrate manufacturing and those applications operating at elevated frequencies. This horizontal non-etching process gives better or comparable performance to existing etch based enhancement processes. Making use of advanced silane technologies, the adhesion mechanisms employed by Secure HFz do not require or create surface roughness. In high frequency applications, the "skin effect" is of major importance, and the low surface roughness associated with the Secure HFz surface ensures minimum signal loss across a wide range of process frequencies.
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