Metal Strip Process

Metal Resist Stripping

With the continued use of full pattern plating process, the removal of the Tin masks remains essential, even in HDI applications. The long term issue has been the complete removal of Sn without excessive damage to the underlying Copper track.

Atotech strippers for Tin or Tin / Lead alloys provide effective stripping on the board surface as well as advanced micro vias. Due to the various current densities occurring across a panel during plating, today's Printed Circuit Board manufacturers are faced with a wide variation of deposit thicknesses on lines and in plated holes. This can lead to significant problems when using conventional stripping systems. The optimised combination of constituents in the Atotech range of products enables you to reliably strip both in the hole and on the board surfaces, regardless of the alloy composition and plating uniformity.

When stripping Tin / Lead from Copper it is also essential that the Cu6Sn5 intermetallic layer is also removed. Atotech's range of strippers completely removes both the Tin / Lead and the intermetallic layer. The use of suitable inhibitors guarantees a bright copper surface and additionally, the copper is protected against oxidation, therefore allowing storage up to several days without tarnishing.

TinSolv & SolderStrip

Atotech's range of two-stage and single-stage metal strippers ensure clean and active copper surfaces after metal resist stripping. The formulations of TinSolv (for tin stripping) and SolderStrip (for tin / lead removal) enable complete and even stripping, both on the surface as well as in small holes and blind vias.

PallaStrip

PallaStrip is a cyanide free palladium stripper that is suitable for use in removal of palladium containing seed layers. The removal of any seeding layer is critical in fine line applications as they can lead to uncontrolled deposition during subsequent plating operations. PallaStrip offers a simple and easy process solution without the use of any harmful cyanide components.

 

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