PallaStrip

PallaStrip IC is a simple cyanide free process that is employed for effectively removing all traces of palladium from surfaces exposed during differential etching of fine line circuits. Unlike tooling hole poisons, this simple 1 step process has been confirmed to efficiently remove Pd from within etched or plated structures.

PallaStrip has been optimized for minimal copper removal, while maintaining a wide process window and can be fully analyzed for full process control and stability.

Features and Benefits

: Incomplete removal of seed layer can lead to unwanted plating

Strips palladium activation layer, does not simply poison or deactivate
Compatible with all palladium seed processes
Very low etch rate on copper (less than 170 nm/min)
Palladium retained in solution to avoid redeposition onto the board