TinSolv & SolderStrip

Atotech's two-stage systems offer the fastest speed with the highest metal loadings, optimised for steady-state operation this process leaves a Copper surface that is fully compatible with all subsequent processes.

The advantages of this technique are that regardless of plating distribution, the first stage chemistry very quickly dissolves the metal all the way down to the intermetallic layer, at which point the reaction stops. Thus, ensuring no unwanted attack on the Copper layer. The metal holding capacity of the first stage chemistry is in excess of 200 g/L, and due to the unique chemistry involved sludge formation is essentially stopped

The second process stage removes only the remaining intermetallic layer. Due to the action of the first stage, and the complete removal of the pure Sn layer, the intermetallic layer is uniform across the entire board area, and this ensures that the problem of differential copper attack (which is often seen in single stage processes) is eliminated. This is very important for subsequent processing, given the progression away from solder leveling to alternative selective finishes, where mechanical soldermask pretreatments are no longer desirable

Features and Benefits

• Fastest process in the world (together with Uniplate)
• Up to two times faster than conventional spray processing
• Perfect stripping of small holes, blind vias and micro blind vias
• No nozzle maintenance
• Fully automatic process control and chemical inventory management systems
• Highest productivity and quality at the lowest cost
• Reduced costs with improved quality