Horizon BondFilm

Horizon BondFilm is an integrated production solution for bonding enhancement.
In today's multilayer production, the traditional oxide processes do not fulfill the latest requirements anymore. In response, the PWB industry in recent years has accepted alternative inner layer bonding enhancement methods to replace oxide in multilayer production.
Comprised of process chemistry and equipment, the Horizon BondFilm system involves three steps and requires only three minutes for complete treatment, including rinsing and drying. The Horizon BondFilm system offers Atotech's latest technology package with respect to chemical processing, thin material conveyance and fluid delivery. From the start, process and equipment have been developed and engineered as a production system, considering all aspects of inner layer bonding. Control package options are available that offer flexibility in terms of system operation as well as monitoring process information.

Horizon BondFilm LDD

In addition to bonding applications, Horizon BondFilm equipment can also be used during pre-treatment for laser direct drilling. BondFilm LDD is a unique process to improve CO2 laser absorption of surfaces prior to laser drilling applications. By creating uniform roughness and optimized surface characteristics, laser drilled micro vias have improved hole size and shape, both of which are critical to high quality HDI PCB manufacturing.
Using this process in the Atotech Horizon BondFilm line gives all the advantages of horizontal equipment and low process costs while offering the advantage of LDD processing instead of the outdated conformal mask and large window technique.