Horizon Stannatech - Perfectly Controlled Immersion Tin System

The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for improved stability and process performance the system is the perfect choice for immersion tin for multiple Pb-free soldering and press-fit technology.

With more than 50 installations, the Horizon Stannatech system is the mostly used immersion tin process worldwide.

Stannatech's 0.9 μm pure tin deposit prevents growth of the intermetallic though the tin layer. This ensures perfect performance for multiple soldering even after 12 month storage. Stannatech is ideally suited for SMT and press fit technology where planar and robust surfaces are required. Stannatech is halogen free, wave and multiple reflow capable and compatible to lead free soldering.

Whisker growth is reduced well below IPC's specification with the 'Anti-Whisker Additive' (AWA) and meets demands of the automotive industry. Surface contamination, which is critical for immersion tin baths can be dramatically minimized by using a special process step, Ionix SF. Yellowing of the tin surface due to the harsh during Pb-free soldering in an air environment is avoided with PostDip 270. Ionix SF standard process steps for Stannatech Horizon, whereas PostDip 270 is offered optionally to Stannatech Horizon.

ConStannic

The ConStannic is a device used to maintain the Sn4+ concentration in the Stannatech bath.
The equipment is patent protected and remains the property of Atotech.
It is lent to the customer as long as Atotech chemistry is used.
The solution of the production plant is transferred to the ConStannic by a transfer pump. The solution is returning back by gravity.

Crystallizer

The Crystallizer is a peripheral device for copper precipitation in production lines with Stannatech solution. It is patent protected equipment and remains the property of Atotech. It is lent to the customer as long as Atotech chemistry is used.
Purpose: The Crystallizer removes copper from the solution in the production line. The copper content is kept around 6-8g/l. At higher concentrations the immersion reaction (tin deposition on PCBs) would slow down.
Flow circuit:  During production Stannatech solution is continuously transferred to the peripheral Crystallizer unit. The copper enriched solution is taken from the production plant by the feed pump. The return pump transfers the solution (with lowered copper content) back to the production plant.

Read more on our pages about:

• Regeneration of Immersion Tin Chemistry