Uniplate Cu System - Horizontal Copper Plating

Uniplate Cu was the first horizontal copper plating system on the market and introduced to the industry in 1987. As the market leader, Atotech is constantly improving both quality and productivity with every new system generation. The inert anode system fitted in the InPlate, InPulse and InPulse2 modules enables maintenance without interrupting production due to the external copper dissolving tank.

The latest InPulse and InPulse2 plating systems are equipped with unique pulse switches for pulse plate operation resulting in best throwing power and highest productivity.

The integration of pulse plating technology and insoluble anodes at the same time was probably one of the biggest technical achievements of our systems engineers. The first system has been successfully operating in a production environment since 1997.

The features of our new Uniplate Cu system include insoluble anode technology, bipolar pulse plating with pulse generators and the InPulse Cu copper electrolyte. Compared to standard DC plating, the systems offers better surface distribution, throwing power results and quality (eg. no scratches, no nodules, and no pitting).

The InPulse Cu system Technology represents a big step towards higher quality with higher productivity and offers the unique opportunity to reduce costs for solder masks, dry films, anode materials, etchant solution and maintenance.

InPulse 2 - The New Dimension for Horizontal Plating Technology

Ever increasing demands for HDI or IC Substrate production processes call for innovative, future-oriented solutions. The new InPulse 2 copper plating system extends the limits of horizontal plating technology to a new dimension.
Atotech's Uniplate InPulse 2 the unique horizontal plating system not only combines the advantages of the worldwide successfully installed and production proven InPulse system, but also offers its full range of major technical improvements such as minimum anode / cathode distance, wide area contact system segmented anodes, the universal transport system (UTS-xs) for ultra flex material processing and new clamp systems for reliable transport.

Uniplate InPulse 2 HF Plater - For Best Blind Micro Via Filling Performance

The Uniplate InPulse 2 System in combination with the InPulse 2HF process is the best choice for the performance of your blind micro via filling with the simultaneous conformal plating of through holes. The process is also ideal for blind micro via filling only, the so called 'Superfilling'.
'Superfilling' gives unmatched BMV filling performance and productivity with the lowest possible surface plated copper. Even BMVs with diameter 170 μm and depth 100 μm are filled without inclusion and with dimple less than 10 μm.

Uniplate InPulse 2THF Plater - For Best Through Hole Filling Performance

The Uniplate InPulse 2 System in combination with the InPulse 2THF process is the best choice for your through hole filling performance. Atotech TH Filling offers high potential in cost savings due to elimination of cap plating (resin plug, cure, brush, PTH and additional panel plating). The benefits include less process steps, short dwell times, thin copper deposit on surface, hence savings in material and processing costs. Quality improvements are achievable due to pure copper filling with improved thermal conductivity, reduced CTE miss match and higher reliability.

Read more on our pages about: