Uniplate LB, NP and Seleo CP Plus - All Options for Through Hole Plating

Atotech's Uniplate LB sets the world standard for classical horizontal through-hole plating. Throughout the world, more than 200 Uniplate LB lines are in production of all kinds of boards including double and multilayer boards, HDI boards, IC Substrates and bare laminate boards for SBU technology. System solutions are available for thick boards as well as ultra thin boards, small board sizes as well as big board sizes.

The new Uniplate LB shows a significant performance increase in electroless copper coverage. With a number of innovative features it is perfectly designed to meet today's industry demands:

• Electroless copper module equipped with fluid delivery systems of latest design for best solution exchange in BMVs and THs
• High-speed, high-throw electroless copper solution Printoganth (EDTA-free)
• Activator Neoganth H for improved hole coverage and larger process window

Uniplate NP is designed for the Neopact direct plating process. The process is based on conductive palladium and is suitable for all base materials including Teflon. With Uniplate Seleo CP Plus Atotech offers a 100% selective direct metallization system based on a conductive polymer. Conductive polymer systems are in production since 1992.

Read more on our pages about:

• Chemical Processes for Horizontal E'less Copper
• Chemical Processes for Direct Plating