
Recent Publications
The intention of publications made by Atotech is to share the results of our extensive research and development on a non commercial basis. With these presentations we aim to provide in-depth process information and inform about the latest investigations and results in each technology field. It should enable the reader to gain a complete and comprehensive understanding of our process solution and of general phenomena encountered in the electroplating industry.
This segment presents the recent papers from the business technology team systems technology.

Uniplate TTS - The New Touchless High Volume Production Technology
Stephen Kenny, Tafadzwa Magaya, Ivan Moncada, Atotech Deutschland GmbH, Germany; November 2011
This paper introduces the Uniplate TTS production system for Touchless Transport of substrates. The system is capable for thin materials with thin copper foil and the active surface is not touched during the entire processing sequence for electroless and electrolytic copper metallization. Development results in material transport and fluid dynamics are shown and the solutions to ensure both effective treatment of the surfaces and safe transport are described. The design of the system ensures that substrates are held so that even flexible thin material may be processed without any problems. The equipment uses special devices to prevent excessive drag out or carry over of processing electrolyte or rinse water so that even though there is no roller contact to the substrate the advantages in reduced water consumption from the Uniplate system are not lost. The latest qualification results with electroless copper metallisation are shown.
Download complete paper here: pdf file (File size 630 kB)
Horizontal Reel to Reel Copper Plating with InPulse 2
Stephen Kenny, Demitry Kostouros, Atotech Deutschland GmbH, Germany; October 2008
This paper presents the latest innovation in the Inpulse 2 plating system which has been modified to allow reel to reel processing using insoluble anodes and a novel copper replenishment system, electrolyte agitation, electrical contact system and special handling devices. Reel to reel plating is a standard technology for production of thin core flexible material where the substrate is treated as a continuous roll and where material handling is critical to ensure uniform results.
Download complete paper here: pdf file (File size 450 kB)

