Connectors of Highest Reliability and Functionality
Precious Metals for Reliable Operations
Precious metal connector terminals ensure reliable operations because of the hardness and wear resistance of precious metals for all coating thicknesses. Pure tin layers with low internal stress, excellent solderability and minimal propensity to whisker are becoming essential for all industrial needs. Based on extensive and fundamental studies e.g. on whisker formation Atotech has developed innovative solutions:
Functional Electronic Coatings for Connector Applications
| Type of Process | Product | Properties |
|---|---|---|
| 3D-MID Plating | Atotech offers the full plating system for 3D-MID technology including pre-and post-treatment, comprising of state-of-the-art copper, nickel and gold electrolytes. | |
| Gold and Gold Alloy Plating | Aurocor® HS | Unsurpassed speed in hard gold plating - Plating rates up to 20 µm/min; high deposition rates result in increased capacity and profitability of reel-to-reel equipment - Aurocor® HSC (cobalt alloyed), Aurocor® HSF (iron alloyed), Aurocor® HSN (nickel alloyed) are the first choice for stamped and solid strip applications. |
| Palladium and Palladium Alloy Plating | Pallacor® HT, Pallacor® HSNS | Palladium plating of highest efficiency and lowest porosit - Pure Pd process Pallacor® HT provides brilliant deposits - Cost effectiveness with Pd-Ni alloys: Pallacor® HSNS is a sulfate-based, chloride-free process, using a significantly reduced level of ammonia, minimizing corrosion of plating equipment and substrate material |
| Silver Plating | Argalux® NC | Cyanide-free alkaline silver process Mildly alkaline, cyanide-free silver process, providing bright silver coatings for electronic and decorative applications that can be directly applied over Ag, brass, bronze and Cu surfaces |
| Nickel Plating | Novoplate® HS | Electrolytic nickel-phosphorus process - Ni-phosphorus process especially designed for requirements of connector and semiconductor industries (deposits with phosphorus content of 4 - 17%) - Stable process and free from ammonia or toxic additives - Complies with most stringent corrosion and wear resistance requirements |
| Tin Plating | Niveostan SL, StannoPure® | Production proven pure tin with minimal whisker risk - Pure tin plating systems providing deposits that exhibit consistent physical and chemical properties and are characterized by excellent solderability - Availabe are bright StannoPure® HSB, semi-bright StannoPure® HBC and matt StannoPure® HSM electrolytes. |
| Nickel Gold Plating | Highest corrosion resistant nickel-gold process - Complete system providing solderable metal coatings with highest corrosion and wear resistance - System includes an electropolishing pretreatment step, followed by nickel / nickel-phosphorus, pre-gold and gold plating |