Innovation and Success in the Age of Green Technologies

New package designs and the rapid implementation of green technologies constitute the biggest challenges to the IC / leadframe industry. Increasingly thinner ICs, new leadframe surface finishes like palladium / gold and higher reflow temperatures test the industries’ manufacturing capabilities, create the greatest reliability concerns and introduce the need to reclassify the packages with respect to their MSL performance.

Functional Electronic Coatings for IC / Leadframe Applications

	Product	Properties
Leadframe Roughening	MoldPrep HMC	The ultimate adhesion enhancement process for MSL improvement To overcome the deterioration of the MSL performance of modern IC packages, leadframes are being roughened, providing mechanical and chemical bonding for increased adhesion to the molding compounds. Atotech’s MoldPrep HMC process has become the industry standard for highest MSL level performance.
Tin Plating	Niveostan SL, Stannopure® HSM	Pure tin plating on outer leads with minimal whisker risk Both processes are the industry-acknowledged, high-speed matt pure tin plating systems, providing deposits that exhibit consistent pyhsical and chemical properties and minimize whisker propensity over a wide current density range (1 - 50 A/dm²). Characterized by excellent solderability, these processes utilize an additive that remains stable at different temperatures.
Ultrathin Ni/Pd/Au	Aurocor® PPF, Pallacor® HT	Controlled deposition of ultrathin Ni/Pd/Au The precisely defined linear plating behavior, even at minimal deposition times, makes of Aurocor® PPF and Pallacor® HT the most suitable systems for preplated leadframes, combining functionality with cost effectiveness.
High Speed Silver Plating	Silvertech HS	Highest speed for silver ring, spot and dot plating – A very low free cyanide alternative Silvertech HS is Atotech’s high-speed alternative for plating matt silver over leadframe surfaces. The process meets industry's most stringent requirements in terms of applied current density (up to 100 A/dm²), gold wire bondability, pH stability and insensitivity to degradation products.