SEMICON China 2010

From March 16 – 18 the SEMICON China 2010 Tradeshow will be held at the Shanghai New International Expo Center in China.

Please feel invited to find out more about our new ideas and developments regarding plating technology for semiconductor applications.

Our highlights at the show are:

Functional Electronic Coatings:

• Atotech's Complete Process Solutions for Connector and IC / Leadframe Industry
• Products and Processes for Tin Plating on IC Outer Leads
• Niveostan SL − Combining Large Grains with Semi-bright Appearance
• Protectostan LF – A Unique Post-treatment to Mitigate the Corrosion Whisker Formation
• Moldprep HMC − New Generation for MSL Improvement
• Anti EBO T13 − Technologies to Prevent Epoxy Bleed Out
• Pallacor® HT and Aurocor® PPF – Reliable and Predictable Ultrathin Ni/Pd/Au Plating
• Atotech's 3D-MID Plating Equipment and Chemistry – A Great Synergy for Molded Interconnect Devices

Semiconductor Technology:

• Stannolyte ST- Immersion Tin on Copper Pillars
• Spherolyte TSV – Through Silicon Via
• Xenolyte Metallization Process
• Xenolyte Reliability

We are looking forward to seeing you in Shanghai in order to discuss with you our latest technologies and the up-coming trends for the semiconductor industry.

For more information regarding the show, please click here: www.semi.org/scchina-en/index.htm