SEMICON Taiwan 2011

From September 07 - 09, SEMICON Taiwan 2011 will be held at Taipei World Trade Center in Taipei, Taiwan.

The show focuses on microelectronics manufacturing. SEMICON Taiwan presents products and information designing and manufacturing the future of semiconductors, MEMS, nanoelectronics, photovoltaics and related advanced electronics. Additionally there will be several theme pavilions where a series of industry hotspots will be exhibited (LED Pavilion, MEMS Pavilion, Green Management Pavilion, etc.).

Our highlights at the show:

• Spherolyte TSV - Through Silicon Via Process
• Xenolyte - Pad Metallization Process
• Stannolyte - Immersion Tin on Copper Pillars
• Everplate 45 nm Series - Copper Damascene Interconnects for sub-45 nm Node Plating
• Atotech's Complete Process Solutions for the Connector and IC Leadframe Industry
• Niveostan SL - Matt Tin Plating Process Combining Large Grains with Semi-bright Appearance
• Atotech's 3D-MID Plating Equipment and Chemistry - A Great Synergy for Molded Interconnect Devices
• MoldPrep HMC - New Generation Adhesion Enhancement for MSL Improvement

We are looking forward to seeing you at the SEMICON Taiwan show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2011 and the upcoming years.

For more information regarding the show, visit: www.semicontaiwan.org/en/