UL Approved

The Covertron® process was developed for decorative and EMI (electro-magnetic impedance) shielding applications. The most widely used plastic substrates for shielding applications are ABS/PC blends and PC. Covertron® eletroless Cu and electroless Ni provide very uniform coatings. The process is used for the metallization of product components such as mobile phones and laptop housings. Atotech's Covertron® Cu systems are also used for special and decorative applications.

Features and Benefits

• Covertron® Cu systems provide stable and reliable processes
• Covertron® Cu systems are totally CN-free 
• Covertron® Cu provides very uniform copper deposition during operation
• Covertron® Ni is the best performing protective layer for copper deposits
• Entire system ensures better adhesion of metal layers on various substrates
• Covertron® is UL approved