SEMICON China 2012

10. February 2012

From March 20 - 22, SEMICON China 2012 will be held at Shanghai New International Expo Center (SNIEC) in Shanghai, China.

The show focuses on microelectronics manufacturing. SEMICON China presents products and information designing and manufacturing the future of semiconductors, MEMS, nanoelectronics, photovoltaic's and related advanced electronics. Additionally there will be four theme pavilions where a series of industry hotspots will be exhibited:

  • China Market IC Application Pavilion
  • TSV Pavilion
  • LED Manufacturing Pavilion
  • Secondary Equipment, Service and Fab Productivity Solutions Pavilion

 Our highlights at the show:

  • Everplate - Copper Damascene Interconnects
  • Spherolyte TSV - Through Silicon Via Process
  • Xenolyte - Pad Metallization Process & Reliability
  • Stannolyte - Immersion Tin on Copper Pillars
  • AntiEbo 13 - Post-treatment to Prevent Epoxy Bleed Out
  • MoldPrep HMC - New Generation Adhesion Enhancement for MSL Improvement
  • Protectostan LF - A Unique Post-treatment to Mitigate Corrosion Whisker Formation
  • Atotech's 3D-MID Plating Equipment and Chemistry - A Great Synergy for Molded Interconnect Devices
  • Products and Processes for Tin Plating on IC Outer Leads
  • Atotech's Full Processes for LED Substrate and Leadframe

We are looking forward to seeing you at the SEMICON China show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2012 and 2013.

For more information regarding the show, visit: www.semiconchina.org/index.htm

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