SEMICON China 2011

17. February 2011

From March 15 - 17, SEMICON China 2011 will be held at Shanghai New International Expo Center (SNIEC) in Shanghai, China.

The show focuses on microelectronics manufacturing. SEMICON China presents products and information designing and manufacturing the future of semiconductors, MEMS, nanoelectronics, photovoltaics and related advanced electronics. Additionally there will be several theme pavilions where a series of industry hotspots will be exhibited. The CSTIC 2011 has 10 symposia including all aspects of semiconductor technology and manufacturing.

Our highlights at the show:

  • Everplate 45 nm Series - Copper Damascene Interconnects for sub-45 nm Node Plating
  • Spherolyte TSV - Through Silicon Via Process
  • Xenolyte - Pad Metallization Process
  • Stannolyte - Immersion Tin on Copper Pillars
  • AntiEbo 13 - Post-treatment to Prevent Epoxy Bleed Out
  • MoldPrep HMC - New Generation Adhesion Enhancement for MSL Improvement
  • Niveostan SL - Matt Tin Plating Process Combining Large Grains with Semi-bright Appearance
  • Protectostan LF - A Unique Post-treatment to mitigate Corrosion Whisker Formation
  • Pallacor HT and Aurocor PPF - Reliable and Predictable Ultrathin Ni/Pd/Au Plating

We are looking forward to seeing you at the SEMICON China show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2011.

For more information regarding the show, visit: www.semiconchina.org/index.htm

back