Corporate News
15. May 2012
NEPCON Malaysia 2012
From June 12 - 14, NEPCON Malaysia 2012 will be held in Penang International Sports Arena (PISA) in Penang, Malaysia.
15. May 2012
JPCA Show 2012
From June 13 - 15, JPCA 2012 will be held at Tokyo Big Sight in Tokyo, Japan.
01. February 2012
Tradefair Preview
More information regarding future Atotech show and tradefair participations.
15. December 2011
Atotech Expands its Production Site and Laboratories in Podnart, Slovenia
30. June 2011
Atotech's new high purity copper plating chemistries
to be manufactured at the new production facility in Germany
12. May 2011
Responding to Market Requirements especially for IC Substrates Applications
Atotech has developed and installed several new and innovative systems
Electronics News
15. May 2012
NEPCON Malaysia 2012
From June 12 - 14, NEPCON Malaysia 2012 will be held in Penang International Sports Arena (PISA) in Penang, Malaysia.
15. May 2012
JPCA Show 2012
From June 13 - 15, JPCA 2012 will be held at Tokyo Big Sight in Tokyo, Japan.
12. May 2011
Responding to Market Requirements especially for IC Substrates Applications
Atotech has developed and installed several new and innovative systems
12. May 2011
The 600th Plater
Since the sale of our 1st Plater in 1986, we now celebrate in May 2011 the delivery of Atotech's 600th Plater to our customer AT&S.
11. October 2010
Uniplate Copper Plating System getting awarded the Total Ecosolutions label
Atotech's Uniplate LB systems require only 50% of the electroless copper thickness in the PTH (Plating Through Hole) process compared to standard vertical lines.
General Metal Finishing News
15. December 2011
Atotech Expands its Production Site and Laboratories in Podnart, Slovenia
02. February 2011
Atotech Gains Volkswagen TL 180 Approval
The new Volkswagen TL 180 specification requires a Cr(VI)-free black zinc flake coating with high corrosion protection for automotive parts.
13. January 2011
Hard Chrome Process for Rotogravure
GravurChrome® is a robust process specifically designed to meet the needs of rotogravure hard Chromium platers.
Electronics Materials News
07. October 2009
New Plugging Paste PP 2793 for high Tg substrates
In addition to the Plugging Paste PP 2795, which is used for standard FR 4 substrates we are now offering the new PP 2793, which is designed for the use in high Tg substrates.
Semiconductor News
30. June 2011
Atotech's new high purity copper plating chemistries
to be manufactured at the new production facility in Germany
17. May 2011
17. May 2011
Atotech opens a new Nanotechnology Laboratory
at Case Western Reserve University, in Cleveland, USA