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Electronic Materials

Liquid Photoimageable Solder Mask (LPISM) for Rigid Boards

A wide range of excellent ELPEMER® Liquid Photoimageable Solder Masks (LPISM) are designed to conform to highest standards in PCB surface protection and serve markets like automotive, communication infrastructure, communication, consumer and others. The application technologies’ range covers screen-printing, air-spray and electrostatic spray, roller- and curtain-coating. The dimensions of product choice are processing requirements, color and surface appearance.
The continuous optimization and adaptation along market requirements as well as balanced cost-performance strategies are intended to keep our customers at the leading edge.

Liquid Photoimageable Solder Mask General Features and Benefits

LPISM is compatible with common surface finishing processes (see table below)

State of the art solder bath stability (20 s @ 265°C, 10 s @ 288°C )

Excellent resist reliability also in harsh environments and elevated temperatures

Reliable edge coverage

No use of brominated binders or flame retardants

Compliance with RoHS (SGS Reports available)

Halogen-free (HF) available

Best flame class UL 94 V0

Overview most important LPISM Products (for details contact our local or global sales staff)

Product Name

Key Property

Comments

SD 2467 SG-DG Series

Screen-printing,
compatible with Stannatech (immersion tin),
also high build and Aurotech (ENIG)

Excellent reliability, extraordinary adhesion,
Pre-treatment: generic micro etch OK

Compatible with Aurotech

Excellent for general use

AS 2467 XM-XG

Compatible with Aurotech

Air-spray & E-spray

SD 2469 SM

Solvent developable

Highest reliability

Surface appearance: SG = silk-glossy, SM = semi-matte, XM = extra-matte,
Color: DG = dark green (other colors available: white, black, blue, red

Liquid Photoimageable Solder Mask (LPISM) Manufactured by Lackwerke Peters distributed and serviced in Asia by Atotech

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More pages on our site you might also be interested in:
Home I PWB & IC Substrate I SC & Wafer Metallization I General Metal Finishing



SD 2467 SG DG 721 after Immersion Tin (no tin penetration below the solder mask)
SD 2467 SG DG 721 after Immersion Tin (no tin penetration below the solder mask)
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Liquid photoimageable solder mask for Immersion Tin
Liquid photoimageable solder mask for Immersion Tin
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